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Renesas announces IoT security certification for RA devices


Renesas announces IoT security certification for RA devices
Renesas has announced both PSA Certified Level 2 and Security Evaluation Standard for IoT Platforms (SESIP) certifications for its RA Family of 32-bit Arm Cortex-M microcontrollers (MCUs).
The company s RA6M4 MCU Group devices with the Flexible Software Package (FSP) have been PSA Level 2 certified, expanding on the PSA Certified Level 1 achieved by RA4 and RA6 Series MCUs. Renesas’ RA6M3, RA6M4, and RA4M2 MCU groups have achieved SESIP1 certification with Physical and Logical Attacker certifications.
Renesas said that in addition to these widely recognized industry certifications, the company s RA MCUs now offer customers improved levels of IoT security by combining Secure Crypto Engine IP with NIST CAVP certifications on top of Arm TrustZone for Armv8-M. ....

Renesa Io , Roger Wendelken , Renesas Product Security Incident Response Team , Flexible Software Package , Root Of Trust , Security Evaluation Standard , Riot Platforms , Arm Cortex M , Logical Attacker , Secure Crypto Engine , Arm Trustzone , Senior Vice President , Renesa Iot , Infrastructure Business , Rot Protection Profile , Common Criteria , Security Functional Requirements , Common Criteria Security Assurance Requirements , Reporting Procedures , ரேனேச ஐயொ , நெகிழ்வான மென்பொருள் ப்யாகேஜ் , வேர் ஆஃப் நம்பிக்கை , பாதுகாப்பு மதிப்பீடு தரநிலை , ஈயொட் தளங்கள் , கை புறணி மீ , பாதுகாப்பானது கிரிப்டோ இயந்திரம் ,

Renesas Expands Low-Power Industrial and IoT Applications Reach With New RA4M2 MCU Group in Arm Cortex-Based MCU Family

Renesas adds new entry-line to RA family


Renesas is expanding its 32-bit RA2 Series microcontrollers (MCUs) with 48 new RA2E1 Group MCUs.
Based on the 48-MHz Arm Cortex-M23 core, the RA2E1 MCUs are entry-line, single-chip devices with up to 128-KB code flash and 16-KB SRAM memory.
The RA2E1 Group MCUs support a wide operating voltage range of 1.6V to 5.5V and a large selection of packages such as LQFP, QFN, LGA, BGA and Wafer Level Chip Scale Package (WLCSP). They are able to deliver optimised combinations of performance, ultra-low-power consumption, innovative peripherals and small package options.
These devices are intended for cost-sensitive applications and other systems requiring high performance and low-energy consumption in space-constrained applications. The new MCUs offer an upgrade path with hardware and software scalability, so they are the perfect entry point into the wide line-up of the Renesas RA family. ....

Renesa Io , Roger Wendelken , Flexible Software Package , Group Mcus , Arm Cortex M , Wafer Level Chip Scale Package , Senior Vice President , Renesa Iot , Infrastructure Business , ரேனேச ஐயொ , நெகிழ்வான மென்பொருள் ப்யாகேஜ் , கை புறணி மீ , செதில் நிலை சிப் அளவு ப்யாகேஜ் , மூத்தவர் துணை ப்ரெஸிடெஂட் , ரேனேச ஈயொட் , உள்கட்டமைப்பு வணிக ,