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Toppan plans to build semiconductor package line for next-generation technology

Toppan plans to build semiconductor package line for next-generation technology
packagingeurope.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from packagingeurope.com Daily Mail and Mail on Sunday newspapers.

Flip Chip Ball Grid Arrays , Ishikawa Prefecture , Integra Plastics , Vilafranca Del Pened ,

Toppan to acquire JOLED's Nomi Site

Toppan Inc. has entered into a sale and purchase agreement with OLED developer and manufacturer JOLED Inc. for the land and buildings at the JOLED Nomi Site in Nomi, Ishikawa Prefecture, Japan. ....

Flip Chip Ball Grid Arrays , Niigata Plant ,

TOPPAN : to Build Line for Development and Mass Production of Next-Generation Semiconductor Packages in Ishikawa, Japan -December 06, 2023 at 05:08 pm EST

The Nomi Site in Japan s Ishikawa Prefecture


Tokyo - December 5, 2023 - TOPPAN Inc. , a TOPPAN Group company and wholly owned subsidiary of TOPPAN Holdings Inc. , has announced. ....

Holdings Inc , Nomi Site , Ishikawa Prefecture , Flip Chip Ball Grid Arrays , Niigata Plant ,