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Multi-billion-dollar investment will make Indiana leader in semiconductor packaging - Vimarsana News

Multi-billion-dollar investment will make Indiana leader in semiconductor packaging

WEST LAFAYETTE, Ind. - Governor Eric J. Holcomb, Secretary of Commerce David Rosenberg, and Purdue University President Mung Chiang joined executives ...

SK hynix to Invest $3.9B in Indiana HBM Fab and R&D with Purdue - High-Performance Computing News Analysis - Vimarsana News

SK hynix to Invest $3.9B in Indiana HBM Fab and R&D with Purdue - High-Performance Computing News Analysis

Memory chip company SK hynix announced it will invest $3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D [...]

Sk Hynix Inc. Announces Plans to Establish New Advanced Packaging Fabrication and R&D Facility for High-Intensity and Ai Microelectronic Products and Applications in Indiana - Vimarsana News

Sk Hynix Inc. Announces Plans to Establish New Advanced Packaging Fabrication and R&D Facility for High-Intensity and Ai Microelectronic Products and Applications in Indiana

Governor Eric J. Holcomb, Secretary of Commerce David Rosenberg and Purdue University President Mung Chiang joined federal partners and executives of South Korea-based SK hynix Inc., the world?s...

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana - Vimarsana News

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

/PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com), the world's leading producer of High-Bandwidth Memory (HBM) chips, announced today that it...

Maker of AI chip announces $3.87B facility, largest-ever investment in Indiana - Vimarsana News

Maker of AI chip announces $3.87B facility, largest-ever investment in Indiana

Purdue's president said SK Hynix's investment would be the largest ever in Indiana and move the state to the forefront of AI in America.

Source: wishtv.com