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TSMC orders more AI chip packaging equipment for Amazon, AMD, Nvidia

Published: September 26, 2023

TSMC has increased orders for CoWoS packaging machines by 30% to cope with increased AI chip demands from Amazon, AMD, Broadcom, and Nvidia. - SamMobile

Source: sammobile.com

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Scientech CorporationGroup Up IndustrialEr Engineering CorporationTaiwan Economic DailyGrand Process Technology

TSMC Accelerates Expansion of Advanced Packaging Facilities: Report

Published: July 14, 2023

Due to high demand for AI and HPC GPUs, TSMC is accelerating pace of its expansion of advanced packaging facilities.

Source: tomshardware.com

Related Topics:

Amkor TechnologySiliconware Precision IndustriesUnited MicroelectronicsRudolph TechnologiesGrand Process TechnologySouthern Taiwan Science ParkAdvanced Backend Fab