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Samsung strikes back in AI chip war with 12-layer HBM3E DRAM

Samsung Electronics succeeded in developing the industry’s first 36-gigabyte (GB) 12-layer HBM3E DRAM, which boasts the fastest data processing speed among AI memory chips, the company said, Tuesday.

Bae-yong-cheol , Baek-byung-yeul , Samsung , Courtesy-of-samsung-electronics-electronic , Samsung-electronics , Courtesy-of-samsung-electronics , Samsung-electronic , High-bandwidth-memory , Hbm , Market , Capacity

Micron starts volume production of HBM3E

Starts sampling 36GB 12-High HBM3E Micron has announced it has begun volume production of the HBM3E (High Bandwidth Memory 3E) solution, which should...

Micron , Hbm3e , Nvidia , H200 ,

Nvidia unveils HGX H200 AI computing platform

Featuring the NVIDIA H200 GPU with 141GB of HBM3e memory At the SC23 conference in Denver, Colorado, Nvidia unveiled the HGX H200, the world's lea...

Supermicro , Lenovo , Amazon-web-services , Nvidia , Hopper-superchip , Dell-technologies , Hewlett-packard-enterprise , Google-cloud , Microsoft-azure , Oracle-cloud-infrastructure , Hgx-h200