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Henkel thin bond line phase change thermal interface material (TIM) recognized by industry innovation award program

Henkel announced today that its phase change thermal interface material (TIM), Bergquist Hi Flow THF 5000UT, was recognized by the 2024 Lightwave Innovation Reviews. Now in its 11th year, this prestigious program enlists experienced optical communications industry experts to evaluate new products for their innovative contributions to fiberoptics and optoelectronics applications. Henkel earned an honoree distinction with its Bergquist Hi Flow THF 5000UT, which received a high score in the c...

Sean-buckley , Wayne-eng , Henkel , Global-technology , Innovation-review , Bergquist-hi-flow , Henkel-data , Telecom-global-head , Editor-in-chief-sean-buckley , Lightwave-innovation-reviews , Lightwave-innovation-review , Press-release-image

Low-pressure, thin bond line thermal interface material (TIM) from Henkel brings best-in-class thermal management solution for next-gen ICs

Adding to its broad portfolio of thermal interface material (TIM) innovations, Henkel announced the commercial availability of Bergquist Hi Flow THF 5000UT. The phase change film TIM marks a significant milestone in thermal management materials development, allowing for low mechanical pressure to achieve thorough wet out and an ultra-thin bond line at the interface. This is critical for challenging package designs with complex architectures, such as lidless multi-chip devices used in high-...

Wayne-eng , Henkel , Bergquist-hi-flow , Henkel-data , Telecom-global-head , Market-strategy , Press-release-image , Adding , Road , Ortfolio , Hermal , Nterface

Henkel Thermal Interface Material

Henkel has announced the commercialization of its latest gel thermal interface material, Bergquist Liqui Form TLF 10000.

Wayne-eng , James-edmondson , Asics , Idtechex-senior-technology-analyst , Henkel , Henkel-data , Telecom-global-head , Market-strategy ,