Low-pressure, thin bond line thermal interface material (TIM) from Henkel brings best-in-class thermal management solution for next-gen ICs
Adding to its broad portfolio of thermal interface material (TIM) innovations, Henkel announced the commercial availability of Bergquist Hi Flow THF 5000UT. The phase change film TIM marks a significant milestone in thermal management materials development, allowing for low mechanical pressure to achieve thorough wet out and an ultra-thin bond line at the interface. This is critical for challenging package designs with complex architectures, such as lidless multi-chip devices used in high-...
Source: webwire.com
