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Infineon Technologies has successfully registered its QDPAK and DDPAK top-side cooling (TSC) packages, which are intended for high-voltage MOSFETs, as a JEDEC standard.
Munich, Germany – 9 February, 2023 – The trends toward higher power density and cost optimization dominate the development goals of efficient high-power applications that create substantial value for segments such as electromobility. To push these boundaries, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced it has successfully registered its QDPAK and DDPAK…