Nvidia places additional orders requiring TSMC CoWoS
Nvidia has placed additional orders for AI chips that require TSMC's CoWoS (chip on wafer on substrate) packaging, according to industry sources.
Source: digitimes.com
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MediaTek announced Dimensity 9200+ chipset for flagship 5G smartphones
MediaTek has expanded its Dimensity portfolio with its new Dimensity 9200+ chipset for flagship 5G smartphones. According to the chipmaker, the new offering builds on the success of its predecessor with a performance upgrade while maintaining power efficiency for longer battery life and better gaming experiences.
Source: digitimes.com
ASEAN offers not just geographical advantages
Colley Hwang, DIGITIMES Asia, Taipei
Source: digitimes.com
TSMC leader highlighted
At the 2023 TSMC Technology Symposium held on May 11, TSMC CEO C.C. Wei highlighted the importance of "trust" in his keynote speech.
Source: digitimes.com
Foxconn: assembly allocation spotlighted, three questions on EV business waiting to be answered
As smartphone clients enter a transition period between new and old products and there are still no clear signs of demend recovery, the market expects Hon Hai Precision Industry (Foxconn) to post sales declines in both QoQ and YoY comparisons in 2Q23. Foxconn will have investor's conference on May 11, where progress of its customers' new handsets and allocations in the supply chain are to be spotlighted. Apart from that, Foxconn's customers and development in server market, its investment and progress in new territories such as EV, and the gloa...
Source: digitimes.com