Page 45 - Hips Components News Today : Breaking News, Live Updates & Top Stories | Vimarsana

The ABF substrate market segment is expected to regain prosperity in 2024, buoyed by rising demand for AI servers, according to market sources.

The Taiwanese government has announced its policy to promote Taiwan as a center for high-end manufacturing and advanced semiconductor processes in Asia. However, key materials, equipment, and technology are still dominated by foreign companies from Japan, the Netherlands, and the U.S. This includes military and aerospace technology, which is vital for national defense, but Taiwan still has limited access to it.

Automotive chip IDMs including STMicroelectronics, NXP, Infineon, and Texas Instruments have their respective most sought-after offerings, which have been in tight supply with prices staying high at China spot market channel distributors, according to supply chain sources.

Samsung Electronics is stepping up its deployment in the advanced packaging field, and reportedly will move its fan-out wafer-level packaging (FOWLP) technology to volume production in the fourth quarter of 2023.

Copper clad laminate (CCL) suppliers in Taiwan have encountered short-term headwinds, with many reporting year-over-year revenue declines in the first quarter, but remain optimistic about long-term demand driven by AI, server, and automotive applications, according to industry sources.