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First intelligent switch family for next generation server and communications systems

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Vik Tymchenko , Gm Platform Hardware Engineering Division At Intel , Renesas Electronics Corporation , Infrastructure Mixed Signal Division At Renesas , Rami Sethi , Infrastructure Mixed Signal Division , Hardware Engineering Division ,

Renesas Unveils I3C Intelligent Switch Family

Renesas Unveils I3C Intelligent Switch Family
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Vik Tymchenko , Gm Platform Hardware Engineering Division At Intel , Infrastructure Mixed Signal Division At Renesas , Renesas Electronics Corporation , Baseboard Management Controllers , Rami Sethi , Vice President , Infrastructure Mixed Signal Division , Hardware Engineering Division ,

Renesas Unveils Industry's First I3C Intelligent Switch Family for Next Generation Server, Storage and Communications Systems – EEJournal

TOKYO, Japan, May 31, 2022 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today unveiled the industry’s first I3C intelligent switch devices targeting next generation server motherboards and other infrastructure equipment. The new chips vastly enhance scalability and reliability while reducing the complexity of high-performance system designs. They enable I3C control plane networks… ....

Vik Tymchenko , Infrastructure Mixed Signal Division , Gm Platform Hardware Engineering Division At Intel , Renesas Electronics Corporation , Baseboard Management Controllers , Rami Sethi , Vice President , General Manager , Hardware Engineering Division ,

Renesas Unveils Industry's First I3C Intelligent Switch Family for Next Generation Server, Storage and Communications Systems – EEJournal

Düsseldorf, May 31, 2022 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today unveiled the industry’s first I3C intelligent switch devices targeting next generation server motherboards and other infrastructure equipment. The new chips vastly enhance scalability and reliability while reducing the complexity of high-performance system designs. They enable I3C control plane networks with multiple initiator… ....

Vik Tymchenko , Infrastructure Mixed Signal Division , Gm Platform Hardware Engineering Division At Intel , Renesas Electronics Corporation , Baseboard Management Controllers , Rami Sethi , Vice President , Hardware Engineering Division ,

Renesas, Intel team for first I3C intelligent switch

Renesas Electronics has launched the first MIPI I3C intelligent switch devices for the next generation server motherboards and other infrastructure equipment. Teams at Renesas and Intel worked closely on the conception, specification definition and other pre silicon activities for the I3C switch design. The collaboration continued to post silicon activities including software development and component […] ....

Vik Tymchenko , Gm Platform Hardware Engineering Division At Intel , Infrastructure Mixed Signal Division At Renesas , Renesas Electronics , Baseboard Management Controllers , Rami Sethi , Vice President , Infrastructure Mixed Signal Division , Hardware Engineering Division ,