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High porosity Co-Al-Fe intermetallic with 3D-microstructures were one-step synthesized via a novel thermal explosion reaction. A link between pore structure and permeability was established using 3D-XRM technology. The corrosion resistance of the samples with different Fe contents was investigated at 900 °C under an oxygen/sulphur atmosphere for up to 120 h. The results showed that the pore structure of the samples remains stable, and the internal matrices are intact due to the formation of a thin protective layer of Al2O3 and Fe2O3 on the surface of the product skeleton. In addition, inward ...

Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level.

Copper/aluminum (Cu/Al) composites with multifunctional applications have been extensively applied in a variety of fields. Nevertheless, the formability of Cu/Al composite strips during micro flexible rolling (MFR) has not been fully investigated in the sub-millimetre range. In the present work, the microstructure, mechanical properties and formability of Cu/Al composite strips during MFR were studied. The microstructure of the annealed and rolled specimens were characterized using scanning electron microscope (SEM) and electron backscatter diffraction (EBSD), and the thickness of Cu/Al compos...

Hydrogen has the highest energy density (120 MJ/kg) of all known substances, approximately three times more than diesel or gasoline, meaning it could play a pivotal role in sustainable energy syst ...