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Synopsys Accelerates Multi-Die Designs with Industry's First Complete HBM3 IP and Verification Solutions - Vimarsana News

Synopsys Accelerates Multi-Die Designs with Industry's First Complete HBM3 IP and Verification Solutions

/PRNewswire/ -- Highlights of this Announcement: The DesignWare HBM3 Controller, PHY, and Verification IP reduces integration risk and maximizes memory...

Synopsys Accelerates Multi-Die Designs with Complete HBM3 IP and Verification Solutions - Vimarsana News

Synopsys Accelerates Multi-Die Designs with Complete HBM3 IP and Verification Solutions

MOUNTAIN VIEW, Calif., Oct. 7, 2021 -- Synopsys, Inc. today announced the industry's first complete HBM3 IP solution, including controller, PHY, and

Synopsys Accelerates Multi-Die Designs with Industry's First Complete HBM3 IP and Verification Solutions – EEJournal - Vimarsana News

Synopsys Accelerates Multi-Die Designs with Industry's First Complete HBM3 IP and Verification Solutions – EEJournal

MOUNTAIN VIEW, Calif., Oct. 7, 2021 /PRNewswire/ -- Highlights of this Announcement: The DesignWare HBM3 Controller, PHY, and Verification IP reduces integration risk and maximizes memory performance in 2.5D multi-die systems Low-latency HBM3 Controller with flexible configuration options enhance memory bandwidth Pre-hardened or configurable HBM3 PHY in 5-nm process operates at 7200 Mbps for up to 2X…

Winbond's OctalNAND Flash interoperates with Synopsys DesignWare AMBA IP - Vimarsana News

Winbond's OctalNAND Flash interoperates with Synopsys DesignWare AMBA IP

Winbond's OctalNAND Flash interoperates with Synopsys DesignWare AMBA IP Winbond Electronics has announced the successful interoperability of Synopsys’ DesignWare Synchronous Serial Interface (SSI) IP with the company's OctalNAND Flash Memory. The DesignWare SSI IP, offering high transfer rates and low latency in serial flash memories and OctalNAND Flash deliver a complete NAND flash memory solution for automotive, mobile and IoT SoCs, enabling faster adoption of octal non-volatile memories (NVM) with high-speed read bandwidth in densities up to 4Gbit. Winbond dev...

Winbond's Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution – EEJournal - Vimarsana News

Winbond's Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution – EEJournal

July 21, 2021 Winbond’s Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution Solution optimizes data transfer rate with low latency for NAND with serial octal interface targeting automotive, mobile and IoT SoCs Taichung, Taiwan – 2021-07-21 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the successful interoperability of Synopsys’ DesignWare Synchronous Serial Interface (SSI) IP and Winbond’s OctalNAND Flash Memory. The DesignWare SSI...