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Transparency Market Research: Wire Bonding Market to Expand at CAGR of 2.9%; Advent of Novel Ultrasonic and Thermosonic Bonding Methods to Boost Market Growth, notes TMR Study

Published: December 7, 2021

- Proliferation of the consumer electronics sector offers value-grab opportunities for manufacturers in the wire bonding market - Extensive demand from semiconductor packaging, microelectronics

Source: finanznachrichten.de

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