Techbond proposes 5-for-4 bonus issue
KUALA LUMPUR (Feb 5): Techbond Group Bhd has proposed to undertake a bonus issue of up to 431.25 million new shares on the basis of five bonus shares for every four existing shares. The entitlement date of the bonus issue shares would be determined later, the global industrial adhesive manufacturer said in a statement today. Managing director Lee Seng Thye said the bonus issue would potentially improve the trading liquidity of Techbond’s shares without affecting the company’s market capitalisation. “This will also encourage greater participation by investors, as well as potentially broa...
Source: theedgemarkets.com