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Intel is investing $7 billion by expanding and improving its Malaysian semiconductor packaging facility. The new packaging will not only reduce costs but also improve performance and power.
On Wednesday Intel will announce a decision to spend $7 billion expanding its packaging facilities in Penang, Malaysia, according to an invitation sent out
SANTA CLARA (dpa-AFX) - U.S. chipmaker Intel (INTC) is reportedly planning to invest 30 billion ringgit or $7.1 billion to build a state-of-the-art facility in Malaysia.According to Reuters, the