Silver-filled and low outgassing epoxy for EMI/RFI shielding
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Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements. It has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C.
Nearly 40% of Global Demand for UV Cured Adhesives Market Comes from Electronics Industry – Fact.MR Study
Nearly 40% of Global Demand for UV Cured Adhesives Market Comes from Electronics Industry – Fact.MR Study
Master Bond EP62-1HTMed is a two part epoxy that meets the requirements of ISO 10993-5 for non-cytotoxicity and therefore can be utilized in many medical device applications.