NXP, TSMC to deliver automotive 16nm FinFET embedded MRAM
NXP Semiconductors and TSMC have jointly announced their collaboration to deliver the industry's first automotive embedded MRAM in 16 nm FinFET technology.
Source: digitimes.com
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Top News In Memory Chips Today - Breaking & Trending Today
Micron intros new datacenter SSD featuring 232-layer NAND
Micron Technology has released two SSDs: the Micron 6500 ION NVMe SSD and the Micron XTR NVMe SSD. These drives, designed to keep up with the accelerating growth of data, provide a major advancement for data centers by cutting operating costs and enhancing storage efficiency.
Source: digitimes.com
SK Hynix takes temporary lead in DDR5 market, real competition to come after Samsung ramp-up
The top two semiconductor suppliers in South Korea, Samsung Electronics and SK Hynix, both reported big net losses in 1Q23. Facing a sluggish memory market, they are counting on the next generation memory, DDR5 DRAM, for sales recovery.
Source: digitimes.com
Samsung develops DRAM supporting CXL 2.0
Samsung Electronics has developed what the company claims is the industry's first 128-gigabyte (GB) DRAM to support Compute Express Link (CXL) 2.0. Intel and Samsung collaborated closely on this revolutionary advancement on an Intel Xeon platform, according to the Korean chipmaker.
Source: digitimes.com
DDR3 prices under downward pressure
DDR3 memory prices are still under downward pressure despite suppliers' output constraints, according to industry sources.
Source: digitimes.com