TSMC to expand advanced packaging capacity at 3 plants: CoWoS, SoIC, SoW for AI GPU demand
The unstoppable demand of AI and one of the keys apart from the GPU and HBM is advanced packaging production, something TSMC is boosting right now.
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The unstoppable demand of AI and one of the keys apart from the GPU and HBM is advanced packaging production, something TSMC is boosting right now.
Samsung has established a team for billions of dollars worth of HBM memory chip supply deals with NVIDIA, to beat HBM leader SK hynix.
SK hynix and Micron are sold out of 2024 + 2025 HBM supply, with TrendForce estimating a 5-10% increase in HBM memory pricing in 2025.
Chief Executive Officer Kwak Noh-Jung said the Nvidia supplier and the world's second-largest memory chipmaker will begin sending samples of the latest version of HBM chips, called 12-layer HBM3E, in May and begin mass producing them in the third-quarter.
NVIDIA CEO Jensen Huang gives SK Group Chairman Chey Tae-won hand-written note: 'to our partnership and creating the future of AI and humanity together'.