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NVIDIA and AMD have purchased all of TSMC's advanced packaging production capacity including CoWoS and SoIC for 2024 and 2025: they're 'fully booked'.
The unstoppable demand of AI and one of the keys apart from the GPU and HBM is advanced packaging production, something TSMC is boosting right now.
Samsung has established a team for billions of dollars worth of HBM memory chip supply deals with NVIDIA, to beat HBM leader SK hynix.
SK hynix and Micron are sold out of 2024 + 2025 HBM supply, with TrendForce estimating a 5-10% increase in HBM memory pricing in 2025.
SK hynix expects to hit $10+ billion in revenue from HBM sales by the end of 2024, as most of its HBM 2024 and even HBM 2025 supply is already sold out.