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NVIDIA and AMD have purchased all of TSMC's advanced packaging production capacity including CoWoS and SoIC for 2024 and 2025: they're 'fully booked'.
Arizona Tsmc Advanced Packaging: In July, TSMC said production at its first chip fabrication facility, or fab, in Arizona would be delayed until 2025 due to a shortage of specialist workers, and it was sending technicians from Taiwan to train local staff. Production had been due to start next year.
In July, TSMC said production at its first chip fabrication facility, or fab, in Arizona would be delayed until 2025 due to a shortage of specialist workers, and it was sending technicians from Taiwan to train local staff. Production had been due to start next year.