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High-Frequency Technology Entirely in Glass


High-Frequency Technology Entirely in Glass
To remain competitive in the field of the Internet of Things, even medium-sized industrial and process metrology companies need to increasingly integrate their sensor circuits into ASICs (application-specific integrated circuits). The semiconductor industry is currently meeting this need with lower costs for development cycles and decreasing quantity hurdles. This is not occurring often enough in chip packaging, meaning that ASICs requiring individual packages are at risk of being bogged down due to the quantity hurdles of package service providers, most of which are Asian. This issue is now resolved by a consortium of seven partners from industry and research. ....

Pactech Gmb , Lithoglas Gmb , German Federal Ministry Of Education , Fraunhofer Institute For Reliability , Laser Electronics , Institute For Microwave Technology Of Ulm University , Interposer Technology , Implementing Highly Compact Electronic Systems , German Federal Ministry , Fraunhofer Institute , Using Pactech , Microwave Technology , Ulm University , Metrology Gmbh , ஜெர்மன் கூட்டாட்சியின் அமைச்சகம் ஆஃப் கல்வி , ப்ரௌுந்ொபேர் நிறுவனம் க்கு நம்பகத்தன்மை , லேசர் மின்னணுவியல் , நிறுவனம் க்கு நுண்ணலை தொழில்நுட்பம் ஆஃப் அல்ம் பல்கலைக்கழகம் , ஜெர்மன் கூட்டாட்சியின் அமைச்சகம் , ப்ரௌுந்ொபேர் நிறுவனம் , நுண்ணலை தொழில்நுட்பம் , அல்ம் பல்கலைக்கழகம் , அளவியல் கஂப் ,