More 'EPYC' Options for HPC - insideHPC
[SPONSORED CONTENT] High performance computing (HPC) often sets trends for the data center. Driving innovation, adding new functionality, and enabling [...]
Source: insidehpc.com
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The NF120: Analysis System for Wafer Level Packaging : Quote, RFQ, Price and Buy
The Nano-focus X-ray Inspection System from SEC is equipped with a Nano-focus Tube of 200-nm resolution, which is dedicated to semiconductor packaging and wafer level packaging (WLP), where sub-micron defects need to be detected. The system can accurately trace and inspect damaged areas by precisely moving the axis with an anti-vibration table. Wafer bump automatic inspection is available throughout Oblique CT / Cone Beam CT. Features High-resolution image with dual-type CTs Application Processor, RAM, PKG Chip, Wafer Level Specifications
Source: azonano.com