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Infineon supplies silicon carbide (SiC) power modules to Xiaomi EV CoolSiC ™ technology provides state-of-the art performance for electric vehicles In addition, Infineon provides further components such as microcontrollers and gate drivers to Xiaomi EV Collaboration reinforces Infineon’s position as the global market leader in automotive semiconductors Munich, Germany, Shanghai, China – 6 May 2024 –…

Germany-based chip maker Infineon has confirmed it will supply its HybridPACK Drive G2 CoolSiC and bare die products to Xiaomi until 2027.

Wolffkran, a key manufacturer of tower cranes, has entered into a joint venture with Saudi group Zamil to set up its first manufacturing plant in the region. The Swiss group will establish a rental fleet of 300 tower cranes in kingdom as part of the JV.

Infineon and Honda have signed an MoU  to  collaborate in power semiconductors, ADAS, and E/E architectures, where both parties will collaborate on new

Infineon Technologies announced that Infineon and Honda Motor have signed a Memorandum of Understanding (MoU) to build a strategic collaboration. Honda selects Infineon as semiconductor partner to align future product and technology roadmaps.