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CHICAGO, May 2, 2023 /PRNewswire/ -- The 3D IC and 2.5D IC packaging market is expected to reach USD 82.0 billion by 2028 from USD 49.3 billion in 2023, at a CAGR of 10.7% during the 2023-2028
Backend demand for 8-bit microcontroller units (MCU) will stay weak through the end of the year, while demand for 32-bit MCUs, as well as industrial and automotive MCUs, will remain stable.
Reduced output by Samsung Electronics and other memory chipmakers will gradually contribute to the industry supply-demand balance later this year, according to , chairman for OSAT Technology (PTI).
Leading Taiwan-based OSATs including Powertech Technology (PTI) and ASE Group are reducing prices amid ongoing cost pressures, according to industry sources.
Taiwan-based OSATs, including ASE Technology Holding (ASEH), Powertech Technology and King Yuan Electronics (KYEC), have reported better-than-expected sales for March, indicating a gradual recovery of the local IC backend service industry.