iST makes a breakthrough in 1.5 Mil Taiko Wafer with High Wafer Strength
iST makes a breakthrough in 1.5 Mil Taiko Wafer with High Wafer Strength TAIPEI, Jan. 6, 2021 /PRNewswire/ -- With the booming development of 5G, IoT and electric vehicles, the requirements for low power consumption are getting more and more demanding, which makes power semiconductors become an irresistible and essential component for these industries. To meet the requirements of customers, iST, Integrated Service Technology Inc. (TWSE: 3289) has put more efforts in its wafer backend process fab (Hsinchu Science Park Building 2) and announces today (January 6, 2021) that it has made a breakth...
Source: finanznachrichten.de