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Cadence and UMC collaborate on 22ULP/ULL reference flow certification Cadence Design Systems and the semiconductor foundry, UMC, have announced that the Cadence digital full flow has been optimised and certified for the UMC 22ULP/ULL process technologies to accelerate consumer, 5G and automotive application design. The flow, which incorporates leading implementation and signoff technology for ultra-low power designs, will enable customers to achieve a much faster path to tape-out. The Cadence digital full flow that has been optimized for use on UMC’s 22ULP/ULL pro...

Cadence collaboration with Arm enables tape-out of next-generation mobile designs Cadence Design Systems has announced that a collaboration with Arm has enabled customers to successfully tape-out next-generation Arm mobile designs. According to Cadence, customers have successfully taped out mobile SoCs using its tools for the next-generation Arm mobile solution, which includes the Arm Cortex-X2, Cortex-A710, and Cortex-A510 CPUs, Mali-G710 GPU and the DynamIQ Shared Unit-110. As part of the collaboration, Cadence has fine-tuned its digital and verification full flows ...

Collaboration looks to accelerate hyperscale computing SoC design Cadence Design Systems has revealed that it has optimised the Cadence digital 20.1 full flow for Samsung Foundry’s advanced-process technologies down to 4nm. As a consequence of the company's collaboration designers can now use Cadence tools to achieve optimal power, performance, and area (PPA) and deliver accurate, first-pass silicon for hyperscale computing applications. Cadence's digital 20.1 flow is able to provide capabilities that are well-suited for Samsung Foundry’s advanced-process tec...