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New Electronics - 3D-IC hybrid bonding reference flow collaboration

United Microelectronics, a global semiconductor foundry, and Cadence Design Systems, have announced that the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC Platform, has been certified for UMC’s chip stacking technologies. ....

Osbert Cheng , Don Chan , Digital Signoff Group At Cadence , Signoff Group , Innovus Implementation System , Quantus Extraction Solution , Tempus Timing Signoff Solution , Pegasus Verification System , Integrity Solution , Celsius Thermal Solver ,

UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow

UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow
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United States , South Korea , Osbert Cheng , Don Chan , Digital Signoff Group At Cadence , United Microelectronics Corporation , Cadence Design Systems Inc , Cadence Design Systems , Signoff Group , Innovus Implementation System , Quantus Extraction Solution , Tempus Timing Signoff Solution , Pegasus Verification System , Integrity Solution , Celsius Thermal Solver ,

Cadence Quantus FS Solution Achieves Certification for Samsung Foundry's SF4, SF3E and SF3 Process Tech

Cadence Quantus FS Solution Achieves Certification for Samsung Foundry's SF4, SF3E and SF3 Process Tech
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Sungjae Lee , Vivek Mishra , Signoff Group At Cadence , Cadence Design Systems Inc , Cadence Design Systems , Samsung Foundry , Cadence Quantus , Quantus Extraction Solution , Cadence Intelligent System Design , Design Enablement , Signoff Group ,

Cadence Quantus FS Solution Achieves Certification for Samsung Foundry's SF4, SF3E, SF3 Process Technologies

Cadence Quantus FS Solution Achieves Certification for Samsung Foundry's SF4, SF3E, SF3 Process Technologies
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Sungjae Lee , Vivek Mishra , Signoff Group At Cadence , Cadence Design Systems Inc , Design Systems , Samsung Foundry , Cadence Quantus , Quantus Extraction Solution , Cadence Intelligent System Design , Design Enablement , Signoff Group ,