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Mitsui Mining and Smelting Co., Ltd: Mitsui Mining & Smelting Co., Ltd.: Expansion of Facility Manufacturing HRDP, a Specialty Carrier for Next Generation Semiconductor Packaging

Published: May 15, 2023

- Second Line to be installed and DOE Facility to be Expanded - Mitsui Mining and Smelting Co., Ltd (President and Representative Director: Takeshi Nou; hereinafter "Mitsui Kinzoku") and GEOMATEC

Source: finanznachrichten.de

Related Topics:

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Mitsui Mining & Smelting Co., Ltd.: Expansion of Facility Manufacturing HRDP®, a Specialty Carrier for Next Generation Semiconductor Packaging

Published: May 15, 2023

— Second Line to be installed and DOE Facility to be Expanded —

Source: ibtimes.com.au

Related Topics:

Kentaro MatsuzakiMitsui KinzokuCorporate Communications DepartmentCarrier For Semiconductor Packaging DeviceMitsui MiningCorporate Planning DivisionHigh Resolution Debondable PanelGeneration Semiconductor Packaging DevicesMitsui Kinzoku Co LtdCo LtdSecond LineRepresentative DirectorTakeshi NouResolution DebondableUltra Fine CircuitsGlass CarrierFan Out Panel Level PackageMass ProductionSpecial Glass CarrierNext Generation Semiconductor Packaging DevicesSpecial CarrierNext Generation Semiconductor Packaging DeviceCommunications DepartmentPress Release