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Top News In Secure Elements Today - Breaking & Trending Today

Tiempo Secure announces TESIC RISC-V Secure Element IP and development kit - Vimarsana News

Tiempo Secure announces TESIC RISC-V Secure Element IP and development kit

Grenoble, France (PRWEB) March 08, 2023 -- As security is increasingly the central issue of any SoC (System on Chip) development, for example taking into

Source: prweb.com
Tiempo Secure gears for further expansion with Mikael Dubreucq and Frederic Heitzmann hired in newly created key positions - Vimarsana News

Tiempo Secure gears for further expansion with Mikael Dubreucq and Frederic Heitzmann hired in newly created key positions

Grenoble, France (PRWEB) November 28, 2022 -- Tiempo Secure has built its notoriety thanks to a high level of expertise in semiconductor design leading to

Source: prweb.com
Secure-IC Acquires Silex Insight's Security Business to Accelerate Its Chip-to-Cloud Plan and Develop the Next-generation of Embedded Cybersecurity Solutions - Vimarsana News

Secure-IC Acquires Silex Insight's Security Business to Accelerate Its Chip-to-Cloud Plan and Develop the Next-generation of Embedded Cybersecurity Solutions

Secure-IC, the rising leader, and the unique global provider of end-to-end cybersecurity solutions for embedded systems and connected objects, announces today the acquisition of Silex Insight's security

Tiempo Secure becomes a Strategic Member of RISC-V International - Vimarsana News

Tiempo Secure becomes a Strategic Member of RISC-V International

Grenoble, France (PRWEB) October 11, 2022 -- By becoming a Strategic Member of RISC-V International, Tiempo Secure expands its offer with a new RISC-V

Source: prweb.com
ETSI and MIPI Alliance Announce Incorporation of MIPI I3C Basic into ETSI Smart Secure Platform - Vimarsana News

ETSI and MIPI Alliance Announce Incorporation of MIPI I3C Basic into ETSI Smart Secure Platform

The MIPI Alliance and ETSI Technical Committee Secure Element Technologies (TC SET) today announced the adoption of the I3C Interface for SSP (TS 103 818) specification, allowing the MIPI I3C Basic specification to serve as a physical and logical link layer for the ETSI Smart Secure Platform (SSP).