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Taipei, Nov. 4 (CNA) The world's largest IC packaging and testing service provider, ASE Technology Holding Co., has introduced advanced packaging solutions for chiplets that are targeted for use in artificial intelligence, automotive electronics, high performance computing devices and 5G applications.
“High future earnings”, “a friendly work environment” and “secure employment” are the top three employer attributes highly rated by Taiwan's university students.
How China Became a Threat to the US’s Tech Leadership
International, domestic tech companies to converge in Taipei Sept. 14-16 | 2022-09-11 10:51:00
At the IEEE hotchips event, Intel's CEO Pat Gelsinger shared to the audience Intel's way of designing extreme integrated circuits on semiconductor for new era of fast-growing AI computing.