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Major U.S. 300mm Chip Manufacturer Places Repeat Order for EAGLEi 300 FOUP Inspection Technology - Vimarsana News

Major U.S. 300mm Chip Manufacturer Places Repeat Order for EAGLEi 300 FOUP Inspection Technology

/PRNewswire/ -- SHELLBACK Semiconductor Technology, a leader in capital equipment solutions to emerging semiconductor markets worldwide, announced today a...

Global FOUP/Cassette Manufacturers Place Multisystem EAGLEi 300 Wafer Carrier Inspection Tool Orders - Vimarsana News

Global FOUP/Cassette Manufacturers Place Multisystem EAGLEi 300 Wafer Carrier Inspection Tool Orders

/PRNewswire/ -- SHELLBACK Semiconductor Technology announced the receipt of multiple EAGLEi 300 Wafer Carrier Inspection system orders from several key FOUP &...