Deep ICP-RIE Etched Trenches with Sidewall Slope Control of GaAs-type High Power PLDs
As part of LASER COMPONENTS‘ presentation marathon at the SPIE LASER conference during Photonics West, Thierno-Mamoudou Diallo, Opto-Electronics and III-V Semiconductor Specialist at LASER COMPONENTS Canada, will introduce new micro-fabrication methods on January 28th at 11:30am PST.
Source: azooptics.com