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Synopsys DesignWare PVT Subsystem Drives Performance, Power and Silicon Lifecycle Management on TSMC's N3 Process Technology Real-Time Chip Insights Provide Optimized Device Utilization Throughout the Silicon Lifecycle for Leading Market Applications News provided by Share this article Highlights for this Announcement: DesignWare PVT monitoring and sensing subsystem IP supports cutting-edge technologies targeting AI, data center, HPC, consumer and 5G markets Innovative, modular architecture offers new sensor technologies for advanced node devices Designers benefit from a complete PVT subsy...

A high precision low power junction temperature sensor that has been developed to be easily embedded into digital ASIC designs. The block features an ...

/PRNewswire/ -- Highlights of this Announcement: Synopsys design solutions certified for the latest version of TSMC's 3nm process technology DRM and SPICE...

MOUNTAIN VIEW, Calif., May 26, 2021 /PRNewswire/ -- Highlights of this Announcement: Synopsys design solutions certified for the latest version of TSMC's 3nm process technology DRM and SPICE models Synopsys and TSMC have collaborated on advanced design enablement using Synopsys' Fusion Design Platform and Custom Design Platform so mutual customers can realize maximum PPA benefits from TSMC's…

Thermal Diode with Base Pin, TSMC N6 Thermal diodes provide a useful means for monitoring junction temperature on die and are typically independently powered from the rest of the SoC. They are especially useful for monitoring changes in junction temperature or when junction temperature has stabilised. This In-Chip Sensing and PVT Monitoring IP is available as part of the Synopsys DesignWare® Foundation IP portfolio. It also forms the foundation of the new Synopsys Silicon Lifecycle Management (SLM) platform. SLM enables new levels of insight for both SoC providers as well as their custo...