MacDermid Alpha to Launch ALPHA HiTech High Tg, Low CTE Underfill and Cornerfill Bonding Materials
MacDermid Alpha to Launch ALPHA HiTech High Tg, Low CTE Underfill and Cornerfill Bonding Materials The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, announces the release of ALPHA HiTech Underfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in variou...
Source: iconnect007.com