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MacDermid Alpha Introduces Ultra-Fine Feature Solder Paste at Productronica China in Shanghai


MacDermid Alpha Introduces Ultra-Fine Feature Solder Paste at Productronica China in Shanghai
The Assembly Solutions division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will introduce ALPHA® OM-372 its latest ultra-fine feature solder paste innovation at Productronica China at the Shanghai New International Expo Centre in Shanghai, China from March 17-19.
ALPHA OM-372 is designed to provide ultra-high electrochemical reliability on fine pitched, low standoff components. ALPHA OM-372 is formulated to deliver low post reflow residue and superior transfer efficiency on fine feature pads as low as 80x130µm (008004). A combination of these best-in-class features as well as excellent HIP and NWO performance makes it ideal for a broad range of high board density applications requiring smaller, thinner, and lighter form factor compon ....

Macdermid Enthone , Hitech Underfill , Macdermid Alpha , Shanghai New International Expo Centre , Macdermid Alpha Electronics Solutions , Assembly Solutions , Semiconductor Solutions , Circuitry Solutions , Productronica China , Dermid Alpha , Tech Underfill , Transition Glass Temperature , Low Coefficient Thermal Expansion , Shanghai New International Expo , ஷாங்காய் புதியது சர்வதேச எக்ஸ்போ மையம் , சட்டசபை தீர்வுகள் , குறைக்கடத்தி தீர்வுகள் , மாற்றம் கண்ணாடி வெப்ப நிலை , ஷாங்காய் புதியது சர்வதேச எக்ஸ்போ ,

MacDermid Alpha to Promote Latest Interconnect Tech, Present on Microvia Reliability at 2021 Virtual IPC APEX EXPO


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MacDermid Alpha to Promote Latest Interconnect Tech, Present on Microvia Reliability at 2021 Virtual IPC APEX EXPO
MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.
The Circuitry Solutions division will highlight the Affinity family of ENIG and ENEPIG final finishes, including their new reduction assisted gold plating process Affinity 3.0, as well as their complete line of leading-edge metallization processes for exceptionally reliable copper filled microvias. Additional details about the newly installed final finish pilot line at their Waterbury, CT Innovation Center and accompanying partnership initiative will be provided. ....

Bill Bowerman , Hitech Underfill , Macdermid Alpha , Macdermid Alpha Electronics Solutions , Assembly Solutions , Ct Innovation Center , Semiconductor Solutions , Circuitry Solutions , Dermid Alpha Electronics Solutions , Pressure Sensitive Adhesive , Tech Underfill , Transition Glass Temperature , Low Coefficient Thermal Expansion , Drop Shock , Impact Bend , Thermal Cycle , Director Primary Metallization , Improvement Strategies , Weak Microvia Interfaces , ர சி து பவர்மேன் , சட்டசபை தீர்வுகள் , கிட்ட கண்டுபிடிப்பு மையம் , குறைக்கடத்தி தீர்வுகள் , மாற்றம் கண்ணாடி வெப்ப நிலை , கைவிட அதிர்ச்சி , தாக்கம் வளைவு ,

MacDermid Alpha to Launch ALPHA HiTech High Tg, Low CTE Underfill and Cornerfill Bonding Materials


MacDermid Alpha to Launch ALPHA HiTech High Tg, Low CTE Underfill and Cornerfill Bonding Materials
The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, announces the release of ALPHA HiTech Underfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.
Both ALPHA HiTech CU21-3240 and ALPHA HiTech CU31-2030 are one-component capillary underfills which are designed for the protection of assembled chip packages onto printed circuit boards, providing excellent reliability performance. ALPHA HiTech CU21-3240 exhibits good thermal cycling performance due to its low coefficient of thermal expansion. It is suitable for applic ....

Hitech Underfills , Assembly Division Of Macdermid Alpha Electronics Solutions , Assembly Division , Macdermid Alpha Electronics Solutions , Tech Underfills , Transition Glass Temperature , Low Coefficient Thermal Expansion , Flip Chip , Drop Shock , Impact Bend , Thermal Cycle , சட்டசபை பிரிவு , மாற்றம் கண்ணாடி வெப்ப நிலை , புரட்டு சிப் , கைவிட அதிர்ச்சி , தாக்கம் வளைவு , வெப்ப மிதிவண்டி ,