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MacDermid Alpha to Promote Latest Interconnect Tech, Present on Microvia Reliability at 2021 Virtual IPC APEX EXPO
MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.
The Circuitry Solutions division will highlight the Affinity family of ENIG and ENEPIG final finishes, including their new reduction assisted gold plating process Affinity 3.0, as well as their complete line of leading-edge metallization processes for exceptionally reliable copper filled microvias. Additional details about the newly installed final finish pilot line at their Waterbury, CT Innovation Center and accompanying partnership initiative will be provided. ....

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