MacDermid Alpha to Promote Latest Interconnect Tech, Present

MacDermid Alpha to Promote Latest Interconnect Tech, Present on Microvia Reliability at 2021 Virtual IPC APEX EXPO


Printer Version
MacDermid Alpha to Promote Latest Interconnect Tech, Present on Microvia Reliability at 2021 Virtual IPC APEX EXPO
MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.
The Circuitry Solutions division will highlight the Affinity family of ENIG and ENEPIG final finishes, including their new reduction assisted gold plating process Affinity 3.0, as well as their complete line of leading-edge metallization processes for exceptionally reliable copper filled microvias. Additional details about the newly installed final finish pilot line at their Waterbury, CT Innovation Center and accompanying partnership initiative will be provided.

Related Keywords

Bill Bowerman , Hitech Underfill , Macdermid Alpha , Macdermid Alpha Electronics Solutions , Assembly Solutions , Ct Innovation Center , Semiconductor Solutions , Circuitry Solutions , Dermid Alpha Electronics Solutions , Pressure Sensitive Adhesive , Tech Underfill , Transition Glass Temperature , Low Coefficient Thermal Expansion , Drop Shock , Impact Bend , Thermal Cycle , Director Primary Metallization , Improvement Strategies , Weak Microvia Interfaces , ர சி து பவர்மேன் , சட்டசபை தீர்வுகள் , கிட்ட கண்டுபிடிப்பு மையம் , குறைக்கடத்தி தீர்வுகள் , மாற்றம் கண்ணாடி வெப்ப நிலை , கைவிட அதிர்ச்சி , தாக்கம் வளைவு , வெப்ப மிதிவண்டி , முன்னேற்றம் உத்திகள் ,

© 2025 Vimarsana