Evertiq - Wafer Back-End Services at AEMtec - a closed loop for you...
AEMtec offers their customers Back-End production stages from wafer to complex micro and optoelectronic module assembly, from one source. Some time ago AEMtec expanded the Wafer Back-End Services by introducing the electroless Under Bumb Metallization (UBM) and the Solder Balling processes. Significantly shorter delivery times, less workload and lower interface losses were achieved. Time-consuming intermediate steps have been eliminated. Steps that are outsourced in the typical industrial process are offered inhouse at AEMtec. Reduction of total lead time from 18 weeks to 8 weeks with the full...
Source: evertiq.com