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KIOXIA unvels Ver 3.1 UFS Embedded Flash Memory Devices - Vimarsana News

KIOXIA unvels Ver 3.1 UFS Embedded Flash Memory Devices

KIOXIA has begun sampling its latest generation of 256 and 512 gigabyte (GB) Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices.

New KIOXIA Ver 3.1 UFS embedded flash memory - Vimarsana News

New KIOXIA Ver 3.1 UFS embedded flash memory

KIOXIA has announced it is now sampling its newest generation of embedded flash memory in 256 and 512 gigabyte (GB) Universal Flash Storage

MIPI M-PHY Gear4 IP (Silicon Proven in TSMC 12FFC) - Vimarsana News

MIPI M-PHY Gear4 IP (Silicon Proven in TSMC 12FFC)

MIPI M-PHY Gear4 IP (Silicon Proven in TSMC 12FFC) MIPI M-PHY Gear4 IP (Silicon Proven in TSMC 12FFC) The MIPI M-PHY Gear 4 IP is compliant with the latest MIPI Feature Storage IP Solution SerDes PHY Product Brief Alliance M-PHY v4.1 Specification, UniPro v1.8 Specification, and Universal Flash Storage (UFS) v3.0 Specification. A serial interface technology with high bandwidth capabilities and supports HS Gear4 rates up to 11.6Gbps, which is particularly developed for mobile applications to obtain low pin count combined with very good power efficiency. The MIPI M-PHY Gear 4 IP compliant t...

Micron announces auto-ready UFS 3.1 and an SSD on 176-layer NAND - Vimarsana News

Micron announces auto-ready UFS 3.1 and an SSD on 176-layer NAND

Jun 1, 2021 9:10pm Micron is adapting new memory and storage technology for smart vehicles and faster, more efficient client computers and data centers as AI and 5G create a data explosion. (Micron Technology) Memory and storage products are the fastest-growing segments of the semiconductor market, moving from about 10% of revenues to more than 25% over the last two decades. It makes sense then that companies like Micron Technology would seek ways to capitalize on that growth by expanding form factors and features of recent products to meet expanding needs in client computers and data center ...

CDRLabs.com - MIcron Unveils New Memory And Storage Innovations At Computex 2021 - Vimarsana News

CDRLabs.com - MIcron Unveils New Memory And Storage Innovations At Computex 2021

Micron Technology, Inc., today unveiled memory and storage innovations across its portfolio based on its industry-leading 176-layer NAND and 1α (1-alpha) DRAM technology, as well as the industry’s first Universal Flash Storage (UFS) 3.1 solution for automotive applications. The new portfolio additions deliver on the company’s vision of accelerating data-driven insights through innovations in memory and storage that enable new capabilities from the data center to the intelligent edge. Micron President and CEO Sanjay Mehrotra made the announcements during a Computex keynote, in which he sh...