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RIT becomes partner in national semiconductor center based at Cornell University

RIT recently became a partner in the SUPREME Center (Superior Energy-efficient Materials and Devices), a new $34 million research center based at Cornell University. The center will focus on development of energy-efficient semiconductor materials and technologies. ....

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Inside DARPA's latest effort to overhaul chip fabrication

Inside DARPA's latest effort to overhaul chip fabrication
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Semiconductor packaging integration center opened

Industrial and government partners announced the creation of the Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES). ....

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Penn State leads semiconductor packaging, heterogeneous integration center

The Semiconductor Research Corporation’s Joint University Microelectronics Program 2.0, a consortium of industrial partners in cooperation with the Defense Advanced Research Projects Agency, has announced the creation of a $32.7 million, Penn State-led Center for Heterogeneous Integration of Micro Electronic Systems. ....

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