YES Receives VertaBond™ Purchase Order from a Tier 1 Memory Manufacturer
YES Receives VertaBond™ Purchase Order from a Tier 1 Memory Manufacturer Share Article Yield Engineering Systems, Inc. announces that a leading memory manufacturer has ordered the YES VertaBond™ system for wafer-to-wafer and die-to-wafer bonding, utilized in bringing next-generation HBM (high bandwidth memory) to market. "This new VertaBond system will enable our valued customer’s most advanced HBM development and pilot production,” said Alex Chow, Asia Sales President & General Manager at YES. FREMONT, Calif. (PRWEB) Mar...