Ansys Collaborates with TSMC to Deliver Thermal Analysis Solution for 3D-IC Designs

/PRNewswire/ -- / Key Highlights The companies collaborated to deliver a comprehensive hierarchical thermal analysis solution for TSMC 3DFabric using...

Related Keywords

Pennsylvania ,United States ,John Lee ,Suk Lee ,Ansys Redhawk ,Ansys Icepak ,Mary Kate Joyce ,Kelsey Debriyn ,Ansys ,Ansys Inc ,Ecosystem Forum On ,Design Infrastructure Management Division ,Comprehensive Hierarchical Thermal Solution ,Innovation Platform ,Ecosystem Forum ,Pervasive Engineering Simulation ,