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Intel Talks Future Cooling Solution For Data Centers: 3D Vapor Chambers To Cool Up To 2000W Next-Gen Chips : vimarsana.com
Intel Talks Future Cooling Solution For Data Centers: 3D Vapor Chambers To Cool Up To 2000W Next-Gen Chips
Intel points to 3D Vapor Chambers as the future of Data Center cooling with up to 2000W of cooling potential for next-gen Xeon chips.
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