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iPhone 16 To Feature Upgraded Thermal Solution Designed For AI-Related Tasks, NAND Flash Rumored To Be Separate From Logic Board : vimarsana.com
iPhone 16 To Feature Upgraded Thermal Solution Designed For AI-Related Tasks, NAND Flash Rumored To Be Separate From Logic Board
A tipster states that Apple will upgraded the cooling solution on the iPhone 16 so the thermal limits remain when running AI tasks
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