Marvell Technology has demonstrated high-speed, ultra-high bandwidth silicon interconnects manufactured using Taiwan Semiconductor Manufacturing Company's (TSMC) 3-nanometer (3nm) process. Marvell's industry-first silicon building blocks in this node include 112G XSR SerDes (serializer/de-serializer), Long Reach SerDes, PCIe Gen 6/CXL 3.0 SerDes, and a 240 Tbps parallel die-to-die interconnect, according to the chip vendor.