Synopsys 3DIC Compiler Qualified for Samsung Foundry's Multi-Die Integration Flow, Accelerating 2.5D and 3D Designs – EEJournal

MOUNTAIN VIEW, Calif., Nov. 17, 2021 /PRNewswire/ -- Highlights: Single, unified 3DIC platform enables system-driven PPA per cubic mm silicon optimization Synopsys and Samsung Foundry are fostering advanced-node and multi-die packaging innovation and productivity for in-demand applications such as HPC, AI, automotive and 5G To strengthen innovation of complex SoCs for compute-intensive applications such as high-performance…

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