Three-Dimensional Bonding of Energy Efficient Electronic Devices

At Osaka University, a new technique has been illustrated by the scientists for making three-dimensional integrated circuit connections that function at low temperatures and does not need external pressure.

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Osaka ,Japan ,Zheng Zhang ,Osaka University ,Integration Laboratory At Osaka University ,Dimensional Bonding Of Energy Efficient Electronic Devices ,Direct Three Dimensional Bonding ,Energy Efficient Electronic ,System Integration Laboratory ,Study First Author ,