"I am happy to share this with you and you are probably the first one I'm sharing this with. In the near term, two full-blown fabs are going to come up in India. These are going to be multi-billion-dollar fabs in the 65, 40 and 28-nanometer technology and there are going to be a host of other packaging proposals that we are evaluating," Chandrasekhar said.
Related Keywords
India , China , Rajeev Chandrasekhar , Narendra Modi , Nirmala Sitharaman , Tower Semiconductors , Tata Group , Samsung , Intel , Israel Based Tower Semiconductors , Prime Minister Narendra Modi , Finance Minister Nirmala Sitharaman , Intel Andrew Grove , Paranoid Survive , Tim Cook , Semiconductor Plants , Multi Billion Dollar , Investment , Chip Assembly , Packaging Units ,
vimarsana.com © 2020. All Rights Reserved.