3d Stacking News Today

Intel's next-gen Clearwater Forest Xeon CPUs should feature Foveros Direct technology to 3D stack up to 288 Darkmont E-Cores on a single Xeon CPU.

Ticker  During AMDs Computex 2021 keynote earlier today, CEO Dr. Lisa Su made a stunning disclosure that may have major ramifications in the days to come for the computing industry. Dr. Su announced that AMD will be producing 3D-stacked chiplets later this year. These chiplets come with stacked caches called 3D V-cache (vertical cache) that is expected to significantly boost gaming performance.  AMDs 3D V-cache allows stacking an additional 64 MB of SRAM cache vertically on top of each core ...