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June 1, 2021
AMD teases their brand new 3D chiplet technology, can have multiple chips stacked on top of each other for next-gen CPU dominance.
June 1, 2021
Tickerย During AMDs Computex 2021 keynote earlier today, CEO Dr. Lisa Su made a stunning disclosure that may have major ramifications in the days to come for the computing industry. Dr. Su announced that AMD will be producing 3D-stacked chiplets later this year. These chiplets come with stacked caches called 3D V-cache (vertical cache) that is expected to significantly boost gaming performance.ย AMDs 3D V-cache allows stacking an additional 64 MB of SRAM cache vertically on top of each core ...