Adaptive Patterning News Today

The US defense department has agreed a contract with SkyWater Technology and Deca Technologies to expand domestic production of fan-out wafer level packaging (FOWLP) services.

The Department of Defense has awarded SkyWater Technology's subsidiary in Florida and the state's Osceola County a contract that would fund the tooling of the Center for Neovation semiconductor manufacturing facility. Work under the contract involves the acquisition and installation of equipment that would enable to use of Deca Technologies' fan-out wafer level packaging technology and the implementation of Deca's Adaptive Patterning design-during-manufacturing capability at ...

SkyWater Technology and Deca Technologies (Deca), a provider of advanced electronic interconnect technology, have announced a new Department of Defense (DOD) effort to expand domestic fan-out wafer level packaging (FOWLP) capabilities for both government and commercial customers.

SkyWater is the first domestic provider of Deca’s M-Series™ fan-out and Adaptive Patterning® technologies to support the reshoring of the semiconductor supply chain ...

SkyWater Technology,  the Minnesota specialist foundry, and Deca Technologies, the packaging specialist have agreed a deal to use Deca’s second generation

YES Adds Deca’s Rapid Cure Technology to its Product Line Share Article Unique UV plus direct thermal exposure process brings throughput & performance advantages “We are extremely pleased to join forces with Deca, an acknowledged leader in the Advanced Packaging field, to enhance our thermal processing portfolio,” said Rezwan Lateef, President of YES. FREMONT, Calif. (PRWEB) January 25, 2021 YES (Yield Engineering Systems, I...